1

Elastic wave modelling in 3D heterogeneous media: 3D grid method

Year:
2002
Language:
english
File:
PDF, 428 KB
english, 2002
4

Defect detection of flip-chip solder joints using modal analysis

Year:
2012
Language:
english
File:
PDF, 1.97 MB
english, 2012
12

Flip chip solder bump inspection using vibration analysis

Year:
2012
Language:
english
File:
PDF, 689 KB
english, 2012
17

Mesh grading approach for wave propagation in high velocity-contrast media

Year:
2013
Language:
english
File:
PDF, 2.19 MB
english, 2013
34

Patterned wafer bonding using ultraviolet adhesive

Year:
2011
Language:
english
File:
PDF, 250 KB
english, 2011
36

P–SV-wave propagation in heterogeneous media: grid method

Year:
1999
Language:
english
File:
PDF, 1.00 MB
english, 1999
48

Fault Diagnosis of Flip Chip Using Vibration and Modal Analysis

Year:
2012
Language:
english
File:
PDF, 537 KB
english, 2012